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- Protection Tape Applicator for Backgrinding Process NEL SYSTEM® Series
Protection Tape Applicator for Backgrinding Process
NEL SYSTEM® Series
Wafer Protection Tape Applicator DR3000-Ⅲ
< Features >
Fully automatic type compatible with wafers up to 12"
After application of ELEP HOLDER adhesive tape for protection of wafer surface (pattern surface), it can be cut to match wafer size.
After application of ELEP HOLDER adhesive tape for protection of wafer surface (pattern surface), it can be cut to match wafer size.
- FOUP / Open cassette applicable
- Low tension tape application system
- Adjustable tape application pressure
- Pressure/temperature dispersal of the wafer surface
- User-friendly touch panel
- User-friendly parameter setting with recipe control
- Tape sag detecting function prior to wafer loading
- Chuck table heating (Max.100 deg°C) function
- Safety Regulation SEMI S2/S8 compliance
- Wafer mapping scanner (optional)
- SECS/GEM communication function (optional )
Wafer Protection Tape Applicator DR8500-Ⅲ/DR8500-Ⅲ-RF
< Features >
Fully automatic type compatible with wafers up to 8"
The system is ipped with a robot arm for wafer transportation and a CCD-type non contact aligner for wafer positioning to prevent dust production during transportation. The system can be operated easily with a touch panel.
The system is ipped with a robot arm for wafer transportation and a CCD-type non contact aligner for wafer positioning to prevent dust production during transportation. The system can be operated easily with a touch panel.
- Wafer transportation with robot arm
- Non-contact wafer alignment using CCD camera
- User-friendly touch panel
- Easy-to-replace consumable parts
- Safety Regulation SEMI S2/S8 compliance
- SECS/GEM communication function (optional)
- Low tension tape application system *1)
- Long-life blade in the cutting system *1)
*1) R8500-Ⅲ-RF only.
Semi-automatic Wafer Protection Tape Applicator DSA840
< Features >
Compact, semi-automatic type tape application system
Automatic processing of ELEP HOLDER application, cutting and rewinding. Compact semi-automatic type. Compatible with wafers up to 8".
Automatic processing of ELEP HOLDER application, cutting and rewinding. Compact semi-automatic type. Compatible with wafers up to 8".
- Semi-automatic type with manual wafer setting and automatic tape application, cutting and waste tape removal
- Electrostatic eliminator (optional)
