Protection Tape Applicator for Backgrinding Process
NEL SYSTEM® Series

This taping system automates the application of protection tape on the surface of the semiconductor wafer during backgrinding.

DR3000Ⅲ

Tape Applicator for wafers up to 12"

< Features >

• FOUP/ Open cassette applicable
• Low tension tape application system
• Adjustable tape application pressure
• Pressure temperature dispersal of the wafer surface
• User friendly touch panel
• User friendly parameter setting with recipe control
• Tape sag detecting function prior to wafer loading
• Chuck table heating (Max. 100℃) function
• Complies to safety regulation SEMI S2/S8
• Wafer mapping scanner (optional)
• SECS/GEM communication function (optional)

DR8500Ⅲ/DR8500ⅢRF

Tape Applicator for wafers up to 8"

< Features >

• User friendly touch panel
• User friendly parameter setting with recipe control
• Easy to replace consumable parts
• Complies to safety regulation SEMI S2/S8
• SECS/GEM communication function (optional)
• Low tension tape application system*

[Remarks]

*Only DR8500-III-RF

DSA840

Semi-automatic Tape Applicator for wafers up to 8"

< Features >

• Wafer setting is done manually
• Tape application, cutting and waste tape removal is done automatically
• Electrostatic eliminator (optional)