Thermal Release Tape For Hard Substrate
NWS-Y5V/NWS-TS322F

Capable of processing brittle wafer.

Outline

Capable of releasing/collecting semiconductor wafers at any stage by constant support of the semiconductor wafer using a supporting wafer. Es pecially recommended for semiconductor wafer processes that rire reverse-side processing.

Features

• Extremely thin grinding capability
• Eliminates warping and sagging by firmly supporting the wafer
• Easily releases at any time with heat treatment

Structure

Properties

Item	Unit	NWS-Y5V	NWS-TS322F
Thickness	μm	111	148
Adhesive strength of thermal release adhesive (normal state)	N/20mm （to silicon）	3.5	1.7
Adhesive strength of thermal release adhesive (after heat treatment)		0.2or Less	0.2or Less
Adhesive strength of pressure-sensitive adhesive		4.0	1.5

[Remarks]

*The figures are a sample of observed values, not guaranteed performance.

Process Flow of Wafer Supporting System

[Remarks]

*After removing this tape, ultralow-volume materials (organic elements) from the adhesive sheet may remain on the substrate. Particles tend to remain, especially on silicon wafers. Please confirm that residual material or particles do not cause problems with the application.