ELEP MOUNT® （EM Series）

Achieves high reliability by combining dicing and die attachment functions.

Outline

This adhesive film is for fixing IC chips to a lead frame or interposer in the semiconductor assembly process. It is useful in realizing high adhesive reliability and in BOC and stacked CSP manufacturing processes, solving conventional silver paste bleeding problems which cause short circuits. It has also been designed to enable use in a continuous process in combination with fixing tape for dicing.

Features

• Outstanding pick-up performance with a 50µm thick chip
• Enables wafer mounting at 40°C
• Integrated with pressure-sensitive dicing tape
• Enables label shaping

Structure

	Chip size	Surface flatness	Line-up	Properties
				Thickness [µm]	Wafer size [mm]	Supply form
C/C	>2mm	Flat	EM-500 (non-cure)	10～40	200 300	Precut/Non-precut
	Small	Flat	EM-310 (cure)
C/S	-	Rough