Sealing Resin Sheet

A thermosetting resin sheet for sealing semiconductors and electronic devices.

Outline

A resin sheet to easily seal semiconductors and electronic devices by press machine or roll laminator. Sealing is achieved by placing the sheet on the device and applying heat and pressure to liquefy the resin. This product is based on an epoxy resin transfer mold, well-known in semiconductor sealing, with high reliability.

Features

• A flexible sheet utilizing a semi-cured epoxy resin.
• Can be supplied in rolls, strips, or labels with a protective release film.
• Superior room temperature storage properties.
• Adheres quickly at low temperatures, and can be cured in a separate curing furnace.
• The liquidity and mechanical properties can be arranged according to the shape and type of the device or base plate.

Structure

Application

[Remarks]

*Please consult us for testing using press machines or laminators.