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	Product Information Surface Protection Double-coated Adhesive Tapes Clean Room Housing & Construction Masking Tapes Flexible Printed Circuits Barcode Labels Optical Products Packaging Tape Electronic Components Products Semiconductor Products Medical products Fluoroplastic Products Porous Film Products Membranes Sealing Materials Products List			UV irradiator for dicing process NEL-U Series UV irradiation reduces the adhesive strength of the wafer protection tape. UA8400 Outline By irradiating UV rays on wafer mount frames after dicing process, it reduces the adhesive strength of the ELEP HOLDER and makes picking up wafer chips easy. Lineup 【UM810】 Semi-auto type UV irradiator. Setting and ejecting wafer mount frames are done manually. 【UA8400】 Full-auto type UV irradiator (single cassette compatible). 【UA3000-II】 Full-auto type UV irradiator (single cassette compatible) compatible with wafers up to Φ12". SEMI standard frame cassette applicable. Friendly operation by touch panel. Friendly operation by touch panel. Complies to various SEMI regulations. Specifications Type UM810 UA8400 UA3000-II Applicable wafer size (Φ) 4" Ο － 5" Ο － 6" Ο － 8" Ο 12" － Ο Applicable frame (Φ) For 5" Ο Δ － For 6" Ο(2 types applicable) － For 8" Ο For 12" － Ο Applicable ELEP HOLDER UE and DU Series Through-put 120 wafers/h (varies depending on irradiation/manual work time) 100 wafers/h (varies depending on irradiation time) 90 wafers/h (varies depending on irradiation time) Power Supply/Air source AC single-phase: 220V 2kW/ordinary use: 0.49MPa or more AC three-phase: 200V 4kW/AC single phase: 100V 1.5kW/ordinary use: 0.49MPa or more AC three-phase: 6kW/ ordinary use: 0.49MPa or more N2 Source ordinary use: 0.29MPa or more Dimension(mm) W630× D620× H1,000 (line height: 900mm) W980× D1,140× H1,600 (line height: 900mm) W980× D1,920× H1,750 (complies to SEMI E15.1) Weight 100kg 600kg

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