Tape Applicator for Dicing Process NEL SYSTEM®

This taping system automates application of protection fixing tape during dicing.

MA3000Ⅲ

Mounter with Tape Removal Function for wafers up to 12"

< Features >

• FOUP/ Open cassette applicable
• Compatible with roll type& precut tape
• Protection tape removal function after wafer mounting
• Improved protection tape removal performance
• Compatible with thin wafers (min. 50μm thick)
• User friendly touch panel
• User friendly parameter setting with recipe control
• Complies to safety regulation SEMI S2/S8
• UV irradiation function for protection tape (optional)
• Wafer mapping scanner (optional)
• SECS/GEM communication function (optional)

MA2008BBS

Mounter for wafers up to 8"

< Features >

• Compatible with roll type& precut tape
• Protection tape removal function after wafer mounting
• Improved protection tape removal performance
• User friendly touch panel
• User friendly parameter setting with recipe control
• Complies to safety regulation SEMI S2/S8
• UV irradiation function for protection tape
• OCR/BCR/BCP(optional)
• Wafer mapping scanner (optional)
• SECS/GEM communication function (optional)

MSA300Ⅱ

Semi-automatic Mounter for wafers up to 12"

< Features >

• Setting of wafer and frame is done manually
• Tape application, cutting and waste tape removal is done automatically
• User friendly touch panel
• Chuck table for square substrates can be produced
• Integrated electrostatic eliminator
• Only for use with roll tape

MSA300PⅡ

Semi-automatic Mounter for wafers up to 12" (Only for use with precut tape)

< Features >

• Setting of wafer and tape is done manually
• Application of tape is done automaticallly
• User friendly touch panel
• User friendly parameter setting with recipe control
• Chuck table heating (Max. 120℃)function
• Compatible with DAF tape application
• Complies to safety regulation SEMI S2/S8
• Only for use with precut tape

MSA840Ⅱ

Semi-automatic Mounter for wafers up to 8"

< Features >

• Setting of wafer and tape is done manually
• Tape application, cutting and waste tape removal is done automatically
• User firendly touch panel
• Chuck table for square substrates can be produced
• Integrated electrostatic eliminator
• Only for use with roll tape

M286N／M265N

Semi-automatic Mounter for wafers up to 8"

< Features >

• Setting of wafer and tape is done manually
• Application of tape is done automatically
• Cutting of tape and waste tape removal is done manually
• Chuck table for square substrates can be produced
• Only for use with roll tape