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Protection Tape Applicator For
Dicing Process NEL SYSTEM®

Wafer Mounter with Protection Tape Removal Function MA3000-Ⅲ
Fully Automatic Mounter for Wafers up to 12"
This fully automatic wafer mounter attaches wafers to a dicing frame with adhesive tape (ELEP HOLDER). It is equipped with a mount removal function to remove the backgrinding protection tape and is ideal for mounting 12" wafers.

< Features >
  • FOUP / Open cassette applicable
  • User-friendly parameter setting with recipe control
  • Compatible with roll type & precut tape
  • Safety Regulation SEMI S2/S8 compliance
  • Protection tape removal function after wafer mounting
  • UV irradiating function for protection tape (optional)
  • Improved protection tape removal performance
  • OCR/BCR/BCP (optional)
  • Compatible with thin wafers (min. 50µm thick)
  • Wafer mapping scanner (optional)
  • User-friendly touch panel
  • SECS/GEM communication function (optional)
Wafer Mounter for Dicing Process MA1508N
Fully Automatic Mounter for Wafers up to 8"
This fully automatic wafer mounter applies wafers to a dicing frame with adhesive tape(ELEP HOLDER).

< Features >
  • "Non-contact chuck method" which contacts only 3-4mm of the wafer edge (Contact chuck method also available)
  • Integrated electrostatic eliminator
  • Displays error messages with a LCD panel and work monitor
  • Wafer ID management system (OCR/BCR/BCP) (optional)
  • Safety Regulation SEMI S2 compliance
  • SECS-I/II communication function (optional)
Semi-automatic Wafer Mounter for Dicing Process MSA300
Semi-automatic Mounter for Wafers up to 12"
This semi -automatic wafer mounter applies wafers to a dicing frame with adhesive tape (ELEP HOLDER).

< Features >
  • Semi-automatic type with manual wafer and frame setting, and automatic tape application, cutting and waste tape removal.
  • "Non-contact chuck method" which contacts only 3-4mm of the wafer edge (Contact chuck method also available)
  • Integrated electrostatic eliminator
  • User-friendly touch panel
  • Only for use with roll tape
Semi-automatic Wafer Mounter for Dicing Process MSA300-P
Semi-automatic Mounter for Wafers up to 12"
This semi -automatic wafer mounter applies wafers to a dicing frame with adhesive tape (ELEP HOLDER).

< Features >
  • Semi-automatic type with manual wafer and frame setting, and automatic tape application.
  • User-friendly parameter setting with recipe control
  • Only for use with precut tape
  • Chuck table heating (Max.120 deg°C) function
  • Compatible with DAF tape application
  • Complies to safety regulation SEMI S2/S8
Semi-automatic Wafer Mounter for Dicing Process MSA840
Semi-automatic Mounter for Wafers up to 8"
This semi -automatic wafer mounter applies wafers to a dicing frame with adhesive tape (ELEP HOLDER).

< Features >
  • Semi-automatic type with manual wafer and frame setting, and automatic tape application/cutting/surrounding tape removal.
  • "Non-contact chuck method" which contacts only 3-4mm of the wafer edge (Contact chuck method also available)
  • Integrated electrostatic eliminator(optional)
Semi-automatic Wafer Mounter for Dicing Process M268N／M265N
Semi-automatic Mounter for Wafers up to 8" (M268N)
Semi-automatic Mounter for Wafers up to 6" (M265N)
This semi -automatic wafer mounter applies wafers to a dicing frame with adhesive tape (ELEP HOLDER).

< Features >
  • Easy automatic operation for tape application with the press of a button. Wafers and frame supply, tape cutting, and unloading of mounted frames are performed manually.
  • "Non-contact chuck method" which contacts only 3-4mm of the wafer edge (Contact chuck method also available)
  • Chuck table for square substrates can be produced

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