Protection tape remover for backgrinding process NEL-H Series
Machine to peel off protection tapes after backgrinding processes.
HR8500-II
Outline
After completion of backgrinding process, it peels off the surface protection tape ELEP HOLDER by using ELEP HOLDER (BT-315) on the wafer.
Line-up
【HSA-840】
This is a semi-auto, compact type protective ELEP HOLDER peeling system. By replacing the table, the system can accommodate wafer sizes of Φ 4",5",6",8".Tape peeling and residual tape take-up are performed automatically by simply pressing the start button.
【HR-8500-II】
This is the full-automatic type that accommodates wafer sizes up to Φ8" .
This system is equipped with a robot arm for wafers transport, and a CCD-type non-contact aligner for wafer positioning so wafers are moved without producing dust.
The system can be easily operated on a touch panel. It also moves wafer of large diameter without producing dusts. As an option, UV irradiator can be installed.
Specifications
Model
HSA-840
HR-8500-II
Applicable wafer size
(Φ)
4"
Ο
Δ
5"
Ο
6"
Ο
8"
Ο
Applicable ELEP Holder
BT-150E Series
BT-315 Series
BT-150 Series
BT-315 Series
Through-put
100 wafers/hr
(varies depending on manual work time)
80 Wafers/h
(processing at 8")
Power supply/Air source
AC single-phase 100V AC, 1kW/ordinary use 0.49MPa or more
