Protection tape applicator for backgrinding process:
NEL-D Series
Tape applicator series that contributes to improve workability for semiconductor wafer processing.
DR8500-II
DR3000-II
Outline
After applying "ELEP HOLDER" adhesive tape to protect the wafer surface (pattern surface), it cuts the tape to match the wafer size.
Lineup
【DR8500-II】
Full-auto mounter compatible with wafers up to Φ8".
This system is equipped with a robot arm for wafer transport, and CCD-type non-contact aligner for wafer positioning, so wafers are moved without producing dust.
This system can be easily operated on a touch panel.
【DSA840】
Automatic handling of ELEP HOLDER application, cutting and take-up. Compact semi-auto type and can handle wafers up to Φ8".
【GR8500-II】 Applies pre-cut ELEP HOLDER with a high degree of accuracy.
Can handle wafers up to Φ8".
【DR3000-II】
Full-auto mounter compatible with wafers up to Φ12".
Equipped with low tension taping system. FOUP/FOSB cassette applicable.
Friendly parameter setting by recipe control touch panel.
Comply to various SEMI regulations.
Specifications
Type
DSA840
DR8500-II
GR8500-II
DR3000-II
Applicable wafer size(Φ)
4"
Ο
Δ
－
5"
Ο
－
6"
Ο
Δ
8"
Ο
12"
－
Ο
Applicable ELEP HOLDER
BT-150E Series
BT-150E Series
BT-50E Series
BT-150E Series
Tape cutting accuracy
Less than ± 0.3mm
Through-put
90 wafers/h
(varies depending on manual work time)
75 wafers/h
(processing at 8")
60 wafers/h
(with normal settings)
Power supply/Air source
AC single-phase: 100V 1kW/ordinary use: 0.49MPa or more
AC single-phase: 200V 1.5kW/ordinary use: 0.49MPa or more
