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| Semiconductor wafer protection/fixing tapes for back grinding and dicing process ELEP HOLDER |
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| Tapes for protection/fixing of different types of wafer during back grinding and dicing process. |
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Outline |
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| ELEP HOLDER® allows to effectively well-protect wafers during the back grinding process,and /or to surely fix the position of wafers for dicing/die-bonding process in semiconductor manufacturing. |
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Process Flow |
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| Line-up |
Features |
Adhesive |
| UV cure |
Pressure
Sensitivity |
Back
Grinding
Process |
BT |
Standard type ,for Au-bump |
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| BT315 |
Peeling off BG tape |
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| UB |
Standard type |
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| BP |
for Solder bump |
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| RF |
Anti-slack/warpage,for thin wafer |
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Dicing
Process |
V、VD |
Standard type, PVC base fille |
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| UE |
PVC base fille |
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| DU |
PO base fille |
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| EM |
Two-in-one DAF |
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| N B D |
for MAP and glass |
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*ELEP HOLDER® is a registered trademark of Nitto Denko.
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