 |
|
|
 |
|
| Masking tape for printed-circuit board |
|
| N-800 |
|
|
|
 |
| For protective of printed-circuit boards from solder when mounting components. |
|
Outline |
|
|
| ELEP masking tape N-800 is a crepe paper masking tape developed for protective of the printed-circuits from solder during the component mounting process. Exhibits excellent solder resistance, flux resistance and strong adhesiveness, yet allows easy peeling after soldering process and leaves almost no adhesive residue. |
|
Features |
|
|
| • |
Easy to unwind and easy to apply. |
| • |
The special adhesive agent makes the tape firmly adhere to the printed-circuit board and does not peel or dislocate during work. |
| • |
Exhibits even higher adhesiveness when pressed with heating roller. |
| • |
Excellent in resistance to solder and flux, and prevents ingress of solution. |
| • |
Withstands severe conditions and leaves almost no adhesive residue. |
| • |
Adhesive strength hardly changes after application, and is easy to peel. |
|
Application |
|
|
| • |
Ideal for preventing ingress of flux or soldering solution during the component mounting process on the circuit boards. |
|
Typical properties |
|
| Product name |
Thickness(mm)*1 |
Adhesive strength(N/18mm)*2 |
| N-800 |
0.14 |
4.80 |
|
|
[Test method]
*1 Nominal thickness
*2 Conforms to JIS Z-0237 standards (Surface material: Stainless steel board, Peeling speed: 300mm/min, Peeling angle: 180°) |
|
Precautions |
|
|
| • |
Avoid sunlight and store at room temperature and moderate humidity. |
| • |
Do not press too strong when applying. This may cause the end of the tape to peel. |
| • |
If applying to surfaces treated with machining oil, degrease the surface carefully. Any remains will be a cause for surface contamination or adhesive residue. |
| • |
For use under severe conditions, please test and evaluate the product thoroughly beforehand. |
| • |
Painting, plating, etching, or gluing the surface after peeling the tape may be troublesome due to the small amount of residue of the adhesive. Please inspect under actual situations thoroughly before application. |
| • |
Painted boards, depending on conditions such as paint baking, may cause the tape to peel uneasily or peel off the paint together. Please evaluate thoroughly beforehand. |
| • |
Surface treated boards such as alumite, depending on treatment conditions, may show different properties (peeling) of SPV. Please evaluate thoroughly beforehand. |
| • |
Especially for applications against natural substrate (marble stone, lumber, et al.) please contact our sales representative in charge. |
| • |
The above datasheet is a sample observation value under certain testing conditions, not guaranteed performance. |
| • |
The quality, performance, and/or functions of this product will differ according to the conditions of use. Please contact our department in charge for full details of this product. |
| • |
Under severe conditions, this product may show difference between the sample observed values and the actual performance. Please test and evaluate the product thoroughly for your safety and better results. |
| • |
This product and/or its features may change or be discontinued without any prior notice. |
| • |
The intellectual property rights of this document belongs to Nitto Denko Corporation. Please contact our department in charge for usage not in accordance of the intended use. Copying and/or reproducing the document without notice are strictly prohibited. All rights reserved. |
|
|
|
|
|
