Thin-film Metal Base Board
with High Resolution Circuit "CISFLEX"

Forms a high resolution circuit with photosensitive Pl and semi-additive copper plating on a metal base.

Features

• High density
• High dimensional precision
• Metal base

Construct

Connection Methods

Solder Bump

• A coreless bump is formed with solder paste.
• Can be thermally bound.

Flying Lead

The entire flying lead is Ni-Au plated.
Can be bonded by normal temperature ultrasonic wave.

Process Accuracy

Gold-ball Bonding Pad

Flying Lead

Back Side Pad

[Remarks]

*SUS is used as the base metal.

*Double-sided pads are available.

*The plating on the pad and the flying lead is either Ni-Au or Au.

Applications

• Hard disk drive