Thin-film Metal Base Board
with High Resolution Circuit "CISFLEX"
Forms a High Resolution Circuit with Photosensitive Pl and Semi-Additive Copper Plating on a Metal Base.
Features
- High density
- High dimensional precision
- Metal base
Construct
Connection Methods
■Solder Bump
A coreless bump is formed with solder paste.
Can be thermally bound
■Flying Lead
The entire flying lead is Ni-Au plated.
Can be bonded by normal temperature ultrasonic wave.
Process Accuracy
■Gold-ball Bonding Pad
■Flying Lead
■Back Side Pad
※SUS is used as the base metal.
※Double-sided pads are available.
※The plating on the pad and the flying lead is either Ni-Au or Au.
Applications