Thin-film Metal Base Board
with High Resolution Circuit "CISFLEX"

Forms a high resolution circuit with photosensitive Pl and semi-additive copper plating on a metal base.

Features

Construct

Connection Methods

■Solder Bump

A coreless bump is formed with solder paste.
Can be thermally bound

■Flying Lead

The entire flying lead is Ni-Au plated.
Can be bonded by normal temperature ultrasonic wave.

Process Accuracy

■Gold-ball Bonding Pad

■Flying Lead

■Back Side Pad

※SUS is used as the base metal.
※Double-sided pads are available.
※The plating on the pad and the flying lead is either Ni-Au or Au.

Applications

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