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- High Density and Precision Flexible Printed Circuit "NITOFLEX®"
High Density and Precision Flexible Printed Circuit
"NITOFLEX®"
Super-Fine Features Created from a Combination of Circuit Production Technology and Designing Technology! We Will Meet the Line Pitch Rirement by Utilizing These Two Processing Technologies.
Technology introduction
Subtractive process
| Conductor thickness | Nominal width | Etch factor |
|---|---|---|
| 12μm[1/3oz] | Line/Space=25/25μm(Precision:<5μm) | Over 3 |
Semi-additive process
| Conductor thickness | Nominal width | Etch factor |
|---|---|---|
| <15μm(Precision:<4μm) | Line/Space=20/20μm(Precision:<3μm) | ∞ |
Features
Subtractive
- High resolution etching technology enables high aspect ratio line processing!
Semi-additive
- Because the conductor shape is not trapezoidal, top width is maintained even at fine pitch!
- No need to make the conductor thin to gain top width!
Application
- For liquid crystal module applications.
* The figures are typical test results, and are not guaranteed values.
* Application samples are only examples. Please evaluate the actual product thoroughly before usage.
