High Density and Precision Flexible Printed Circuit
"NITOFLEX®"
Super-fine features created from a combination of circuit production technology and designing technology. We will meet the line pitch requirement by utilizing these two processing technologies.
| Conductor thickness | Nominal width | Etch factor |
| 12μm[1/3oz] |
Line/Space=25/25μm(Precision:<5μm) |
Over 3 |
|
| Conductor thickness | Nominal width | Etch factor |
| <15μm(Precision:<4μm) |
Line/Space=20/20μm(Precision:<3μm) |
∞ |
|
- High resolution etching technology enables high aspect ratio line processing.
|
- Because the conductor shape is not trapezoidal, top width is maintained even at fine pitch.
- No need to make the conductor thin to gain top width.
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- For liquid crystal module applications.
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* The figures are typical test results, and are not guaranteed values.
* Application samples are only examples. Please evaluate the actual product thoroughly before usage. |
