Special Film, Heat Resistant, Minimal Adhesion Tape/Sheet
FB-MP Tape/Sheet

Special film backing, heat resistant, minimal adhesion tape which wan be peeled off effortlessly even after heating.

* This product is available at NITTO SHINKO Corporation.
Contact: TEL: 81-0776-67-8086

• NITTO SHINKO Corporation

Outline

Minimal adhesion sheet with superior heat resistance Heat resistant minimum adhesion sheet suitable for various heat treatment processes during manufacturing processes of printed circuit boards and device components.

Features

• Minimum adhesion for easy peeling.
• Low adhesive residue even after heating, and high dimensional stability.
• Extensive normal temperature storage stability (normal temperature x 6 months).
• Superior die-cutting processability.

Structure

Properties

Product No.	*1 Thickness[mm]		Standard length[m]	Color	180°peeling strength [N/20mm]
	Total	Backing
FB-MT45SF	0.058	0.050	165	Transparent	0.11
T-APN10	0.020	0.016	200	Transparent	0.20

[Remarks]

The figures are a sample of observed values, not guaranteed performance.

*1: Without release liner.

Applications

• Reinforcement/masking of ultra-thin circuits (copper applied substrate , copper.
• Protection while opening through-holes.
• Masking when filling conductive paste.