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Special Film, Heat Resistant, Minimal Adhesion Tape/Sheet
FB-MP Series

Special Film Substrate, Heat Resistant, Minimal Adhesion Tape which wan be Peeled off Effortlessly Even after Heating.

*This is a product of Nitto Shinko.
Please contact the customer center. TEL: 0776-67-8086
Outline
Minimal adhesion sheet with superior heat resistance
Heat resistant minimum adhesion sheet suitable for various heat treatment processes during manufacturing processes of printed circuit boards and device components.
Features
  • Minimum adhesion for easy peeling.
  • Low adhesive residue even after heating, and high dimensional stability.
  • Extensive normal temperature storage stability (normal temperature x 6 months).
  • Superior die-cutting processability.
Structure

Properties
Product No. Thickness [mm] Standard length [m] Color 180°peeling
strength
[N/20mm]
Total Substrate
FB-MP45 0.058 0.05 200 Transparent 0.10
FB-MT45SF 0.058 0.05 165 Transparent 0.11
T-APN10 0.02 0.016 200 Transparent 0.20
* The figures are a sample of observed values, not guaranteed performance.
Applications
  • Reinforcement/masking of ultra-thin circuits (copper applied substrate , copper
  • Protection while opening through-holes
  • Masking when filling conductive paste

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