Protects delicate circuit boards from humidity, dew condensation, dust and vibration.
Outline
Circuit boards mounted with ICs and LSIs are used in everyday goods such as automated products for car, computers and toys. However, the weakness of circuit board is that they are "vulnerable to various environments." "ELEP COAT LSS-520 MH " is a liquid sealing material using modified rubber material for its base and prevents humidity, dew condensation, dust and vibration which cause circuit board malfunctions. Further, it has minimal stress to components and does not cause bad effect such as cracks and current leaks for the board. It is widely used for moistureproof and insulation of IC/LSI mounted circuit boards and electronic parts, or as a coating and sealing material for various components.
Features
•
Low thermal expansion coefficient and low Young's modulus. Does not stress boards and chips since it is not affected by temperature changes.
•
Rubber-based material has high resistance to water, electricity and shock, and offers superior damp/water proofing, insulation, dust proofing and protection properties.
•
Highly viscous liquid offers superior bonding properties and adheres well to materials without fail.
•
Forms a film within 5-10 minutes after applying; the film is elastic and prevents cracks because of the modified rubber-based polymer base material.
•
Includes almost no ion impurities which cause corrosion.
Specifications
Property
Shape
Transparent viscous liquid
Solid content
25%
Viscosity (30 °C )
4dPa⋅s
Gravity (d420)
0.817
General properties
Property
Unit
Value
Young ' s modulus (20 °C)
N/mm²
75
Elongation (20 °C)
%
460
Tensile strength (20 °C)
N/mm²
25
Moisture permeability
g/cm²-day
0.002
Hardness
Shore A
6.0
* The above values are sample observed values, not the guaranteed performance.
