As electronics devices became more sophisticated, heat production from computer parts and IC chips increased, and the conventional method such as forced cooling methods or heat dissipation sheets are insufficient to cool or dissipate heat, thus made a " thermal design" a major issue to be considered. Nitto Shinko has developed a heat dissipation sheet with superior thermal conductivity and electrical insulation, by adding thermal- conductive fillers to elastomer materials, which is a really unique " thermal design".