Thermal Conductive HT Sheet

Thermal conductive sheet effective in heat dissipation and cooling of IC chips and others.

* This product is available at NITTO SHINKO Corporation.
Contact: TEL: 81-0776-67-8086

• NITTO SHINKO Corporation

Outline

As electronics devices became more sophisticated, heat production from computer parts and IC chips increased, and the conventional method such as forced cooling methods or heat dissipation sheets are insufficient to cool or dissipate heat, thus made a " thermal design" a major issue to be considered. Nitto Shinko has developed a heat dissipation sheet with superior thermal conductivity and electrical insulation, by adding thermal- conductive fillers to elastomer materials, which is a really unique " thermal design".

Features

• Using silicon gel as the matrix resin, it offers excellent thermal conductivity.
• Excellently fits to uneven surfaces with good stress relaxation.
• Various types of thickness are available to suit various gaps.

Structure

General properties

Type	Color	Series	Product No.	Thick-ness	Tacking property	Thermal resis- tance	Thermal conduc-tivity	Hard-ness	UL94 ※4
Gel	black	HT-***	HT-050	0.5	Minimal /standard	0.50 × 10 -3	1	25 ※2	V-1
			HT-080	0.8		0.80 × 10 -3
			HT-100	1		0.90 × 10 -3		20 ※2
			HT-250	2.5	Double side	2.10 × 10 -3		15 ※3
	gray	HT-***S	HT-270S	2.7	Double side	1.00 × 10 -3	1.2	6 ※3	V-0 i- valent
	sky blue	HT-***HL	HT-100HL	1	Double side	0.37 × 10 -3	3	35 ※3	V-0
			HT-180HL	1.8		0.64 × 10 -3
			HT-200HL	2		0.74 × 10 -3
			HT-300HL	3		1.17 × 10 -3
Rubber	light blue	HTR-***	HTR-025(G)	0.25	None	0.31 × 10 -3	0.8	90 ※2	V-1

[Remarks]

*1:ASTM E-1530 method

*2:JIS K 7312 measurements made with type A hardness tester

*3:JIS K 7312 measurements made with type C hardness tester

*4:UL94 Flame Retardant Class E119061

*The figures are a sample of observed values, not guaranteed performance.