Main Menu
- HOME
- Product Information
- Tapes for Electronic Components
- Chip Cover Tape for Paper Carrier
Chip Cover Tape for Paper Carrier
Thermal Bonding Tape for Enclosing Surface Mounting Electronic Components on Paper Carriers.
Outline
No.318H Series is a series of thermal bonding tape developed for enclosing surface mounting electronic components on paper carriers. The tapes exhibit stable bonding strength for various types of paper carriers and largely contribute to automation and enhance reliability for the surface mounting process.
Features
- Offers superior thermal bonding to paper carriers.
- Reduces surface mounting failure , for the components will not be displaced by static electricity during surface mounting processes.
- Tape peeling is stable during surface mounting.
- Available in long lengths (Top cover tape: 8,000 m, bottom cover tape: 24,000m ).
- Tape does not break or tear during peeling.
Structure
Applications
- Enclosing surface mounting electronic component on paper carriers.
General Properties
| Product No. | Thick ness [mm] |
Standard length [mm] |
Color | Tensil estrength |
Elongation [%] |
|---|---|---|---|---|---|
| No.318H-14A | 0.055 | 1000,8000 | Transparent | 27 [N/5.25mm] |
120 |
| No.318H-55P | 0.050 | 1000,8000, 16000,24000 |
Cream | 12 [N/5.25mm] |
3 |
※The figures are a sample of observed values, not guaranteed performance.
※NOMEX(R) is a registered trademark of DuPont。
※NOMEX(R) is a registered trademark of DuPont。
