Chip Cover Tape for Paper Carrier

Thermal bonding tape for enclosing surface mounting electronic components on paper carriers.

Outline

No.318H Series is a series of thermal bonding tape developed for enclosing surface mounting electronic components on paper carriers. The tapes exhibit stable bonding strength for various types of paper carriers and largely contribute to automation and enhance reliability for the surface mounting process.

Features

• Offers superior thermal bonding to paper carriers.
• Reduces surface mounting failure , for the components will not be displaced by static electricity during surface mounting processes.
• Tape peeling is stable during surface mounting.
• Available in long lengths (Top cover tape: 8,000 m, bottom cover tape: 24,000m ).
• Tape does not break or tear during peeling.

Structure

Applications

• Enclosing surface mounting electronic component on paper carriers.

General Properties

Product No.	Thick ness [mm]	Standard length [mm]	Color	Tensil estrength	Elongation [%]
No.318H-14A	0.055	1000,8000	Transparent	27 [N/5.25mm]	120
No.318H-55P	0.050	1000,8000, 16000,24000	Cream	12 [N/5.25mm]	3

[Remarks]

The figures are a sample of observed values, not guaranteed performance.

NOMEX(R) is a registered trademark of DuPont.