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HOME > Product Information > Double-coated Adhesive Tapes > Adhesive sheet for flexible printed circuits B-EL10

Adhesive sheet for flexible printed circuits
B-EL10
Offers extremely strong bonding of glass epoxy and polyimide. Thermosetting adhesive sheet realizes temporary fastening by heat lamination and hardening by oven curing.
PHOTO

Features
•  Minimal tackiness makes the tape easy to work with by temporarily fixing small components so they don’t become mispositioned.
•  Minimal resin flow during heat/pressure attachment
•  Compatible with both surfaces of stiffener (glass epoxy) and CCL (polyimide), and offers superior peel strength.
•  Modified resin provides the proper amount of flexibility after hardening.

Structure

IMG

Properties

Product No. Release liner Thickness
(mm)
Peel strength/RT Bonding conditions
Side 1 Side 2 Measurement value Unit °C Time(min.)
B-EF10 Paper PET 0.04 Peeling 22 N/cm 150 60

Applications
•  Bonding of FPC stiffener

IMG



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