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HOME > Product Information > Double-coated Adhesive Tapes > Bonding sheet for electronic components B-EF56/B-EFP11
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Bonding sheet for electronic components
B-EF56/B-EFP11
Thermosetting bonding sheet uses no solvents. The sheet offers superior sealing performance between different types of materials at high temperatures.
PHOTO
* This product is available at NITTO SHINKO Corporation.
?Contact: TEL: 03-5740-2171

Features
•  B-EF56 is manufactured without use of solvents so it doesn’t give off toxic solvent gas while thermosetting.
•  Doesn’t have a release liner so it is easy to use and doesn’t produce trash.
•  Heating produces the proper amount of resin flow for sealing.

Structure

IMG

Properties

Product No. Thickness
[mm]
Shear strength/RT Bonding conditions
Measurement value Unit °C Time
(min.)
B-EF56 0.35 Shearing 980 N/cm² 130 120
B-EFP11 0.29 Shearing 1,200 N/cm² 150 60
* The above values are sample observed values, not the guaranteed performance.

Applications
•  Bonding/encapsulating of packages for hybrid ICs.
•  Bonding/encapsulating of thermal fuses.

IMG



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