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| Bonding sheet for electronic components |
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| B-EF56/B-EFP11 |
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| Thermosetting bonding sheet uses no solvents. The sheet offers superior sealing performance between different types of materials at high temperatures. |
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* This product is available at NITTO SHINKO Corporation.
?Contact: TEL: 03-5740-2171 |
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Features |
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B-EF56 is manufactured without use of solvents so it doesn’t give off toxic solvent gas while thermosetting. |
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Doesn’t have a release liner so it is easy to use and doesn’t produce trash. |
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Heating produces the proper amount of resin flow for sealing. |
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Structure |
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Properties |
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| Product No. |
Thickness
[mm] |
Shear strength/RT |
Bonding conditions |
| Measurement value |
Unit |
°C |
Time
(min.) |
| B-EF56 |
0.35 |
Shearing 980 |
N/cm² |
130 |
120 |
| B-EFP11 |
0.29 |
Shearing 1,200 |
N/cm² |
150 |
60 |
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| * The above values are sample observed values, not the guaranteed performance. |
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Applications |
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Bonding/encapsulating of packages for hybrid ICs. |
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Bonding/encapsulating of thermal fuses. |
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