B-EF56/B-EFP11
Bonding sheet for electronic components. Thermosetting bonding sheet uses no solvents. The sheet offers superior sealing performance between different types of materials at high temperatures.
- B-EF56 is manufactured without use of solvents so it doesn't give off toxic solvent gas while thermosetting.
- Doesn't have a release liner so it is easy to use and doesn't produce trash.
- Heating produces the proper amount of resin flow for sealing.
|
| Product No. | Thickness
[mm] | Shear strength/RT | Bonding conditions |
| Measurement value | Unit | °C | Time
(min.) |
| B-EF56 |
0.35 |
Shearing 980 |
N/cm² |
130 |
120 |
| B-EFP11 |
0.29 |
Shearing 1,200 |
N/cm² |
150 |
60 |
|
* The above values are sample observed values, not the guaranteed performance. |
- Bonding/encapsulating of packages for hybrid ICs.
- Bonding/encapsulating of thermal fuses.
|
