B-EF56/B-EFP11

Bonding sheet for electronic components. Thermosetting bonding sheet uses no solvents. The sheet offers superior sealing performance between different types of materials at high temperatures.

Features

• B-EF56 is manufactured without use of solvents so it doesn't give off toxic solvent gas while thermosetting.
• Doesn't have a release liner so it is easy to use and doesn't produce trash.
• Heating produces the proper amount of resin flow for sealing.

Features

Properties

Product No.	Thickness [mm]	Shear strength/RT		Bonding conditions
		Measurement value	Unit	°C	Time (min.)
B-EF56	0.35	Shearing 980	N/cm2	130	120
B-EFP11	0.29	Shearing 1,200	N/cm2	150	60

[Remarks]

*The above values are sample observed values, not the guaranteed performance.

Application

• Bonding/encapsulating of packages for hybrid ICs.
• Bonding/encapsulating of thermal fuses.