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B-EF56/B-EFP11

Bonding sheet for electronic components. Thermosetting bonding sheet uses no solvents. The sheet offers superior sealing performance between different types of materials at high temperatures.

* This product is available at NITTO SHINKO Corporation.
Contact: TEL: 03-5740-2171
Features
  • B-EF56 is manufactured without use of solvents so it doesn't give off toxic solvent gas while thermosetting.
  • Doesn't have a release liner so it is easy to use and doesn't produce trash.
  • Heating produces the proper amount of resin flow for sealing.
Features

Properties
Product No. Thickness
[mm]		 Shear strength/RT Bonding conditions
Measurement value Unit °C Time
(min.)
B-EF56 0.35 Shearing 980 N/cm² 130 120
B-EFP11 0.29 Shearing 1,200 N/cm² 150 60
* The above values are sample observed values, not the guaranteed performance.
Application
  • Bonding/encapsulating of packages for hybrid ICs.
  • Bonding/encapsulating of thermal fuses.

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