Heat-resistant double-coated adhesive tape for FPC in SMT process
No.581
Nitto Denko No.581 double-coated adhesive tape with superior heat resistance of both carrier material and adhesive. Firmly fix FPC in SMT process, and it is reusable.
Features
•
Firm temporary fixing of FPC in SMT process, cleanly removable after the process, and reusable.
•
Cleanly removable from carriage.
•
Both base material and adhesive have enough heat resistance for reflow.
Structure
Properties
Thickness [mm]
0.085
180°
peeling strength [N/20mm]
Substrate
5.5(side 1) For aluminum
Substrate
0.9(side 2) For polyimide
Carrier material
Heat resistant film
* The above values are sample observed values, not the guaranteed performance.
Applications
•
Temporary fixing of FPC in SMT process.
* The applications given herein are suggested examples. Please make sure the product is capable of the application before actually attempting to put it to use.
