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| Heat-resistant double-coated adhesive tape for FPC in SMT process |
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| No.581 |
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| Nitto Denko No.581 double-coated adhesive tape with superior heat resistance of both carrier material and adhesive. Firmly fix FPC in SMT process, and it is reusable. |
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Features |
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Firm temporary fixing of FPC in SMT process, cleanly removable after the process, and reusable. |
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Cleanly removable from carriage. |
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Both base material and adhesive have enough heat resistance for reflow. |
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Structure |
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Properties |
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| Thickness [mm] |
0.085 |
| 180°
peeling strength [N/20mm] |
Substrate |
5.5(side 1) For aluminum |
| Substrate |
0.9(side 2) For polyimide |
| Carrier material |
Heat resistant film |
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| * The above values are sample observed values, not the guaranteed performance. |
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Applications |
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Temporary fixing of FPC in SMT process. |
| * The applications given herein are suggested examples. Please make sure the product is capable of the application before actually attempting to put it to use. |
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