No.5919ML

Heat resistant double-coated adhesive tape. No.5919ML is double coated adhesive tape for fixing of (*) FPC and stiffener or FPC and housings. The release liner and adhesive can withstand high temperature (peak at 260 degree c.) of the reflow soldering process.

[Remarks]

*FPC：Flexble Printed Circuits

Features

• Non-base adhesive tape.
• Excellent heat resistance and bonding performance.
• Release liner is also heat resistant, which can be used with release liner at soldering process.
• Available in double release liner (PN:No.5919MLW)

Structure

Properties

Substrates	Adhesion
Stainless steel plate	8.5
Polyimide film	11.8
Polyester film	11.0
Glass epoxy plate	11.0

[Remarks]

*Backing: PET #25

Peeling speed: 300mm/min

Peeling angle: 180 degree

Measurement condition: 23 degree C. x 50 percent RH

Property	Adhesion
Initial	8.5
After IR reflow	8.5

[Remarks]

Substrate:Stainless steel plate

Reflow peak temperature: 260 degree C.

Measurement temperature:23 degree C. x 50 percent RH

Peeling speed:300mm/min

Measurement Conditions	Slippage
40 degree C.	0.1
100 degree C.	0.1

[Remarks]

Substrate:phenol resin plate

Tape area:10mmx20mm

Load:4.9N

Measurement condition:40 degree C. 100 degree C. x an hour

The data provided herein are not guaranteed values, but rather measurement values given as an example.

Applications

• Fixing of FPC and stiffener
• Fixing of FPC and Housing for Electronics equipment.
• Fixing of compact cooling plate for electronics equipment.

[Remarks]

*Nitto Denko does not guarantee that the tape can be used for the example applications provided herein. You should make sure the tape is suitable for the substrate by applying to some of the material prior to using for practical application