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Heat resistant double coated adhesive tape
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No.5919ML is double coated adhesive tape for fixing of (*) FPC and stiffener or FPC and housings.
The release liner and adhesive can withstand high temperature (peak at 260 degree C.) of the reflow soldering process.
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*FPC: Flexible Printed Circuits
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Features |
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Non-base adhesive tape. |
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Excellent heat resistance and bonding performance. |
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Release liner is also heat resistant, which can be used with release liner at soldering process. |
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Available in double release liner (PN:No.5919MLW) |
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Structure |
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Characteristics |
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Substrates |
Adhesion |
| Stainless steel plate |
8.5 |
| Polyimide film |
11.8 |
| Polyester film |
11.0 |
| Glass epoxy plate |
11.0 |
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*Backing: PET #25
Peeling speed: 300mm/min
Peeling angle: 180 degree
Measurement condition: 23 degree C. x 50 percent RH
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| •180 degree peeling adhesion before and after IR
reflow(soldering) |
Units:N/20mm |
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Adhesion |
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Initial |
8.5 |
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After IR reflow |
8.5 |
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Substrate:Stainless steel plate
Reflow peak temperature: 260 degree C.
Measurement temperature:23 degree C. x 50 percent RH
Peeling speed:300mm/min
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| •Holding power |
Units:mm/hr |
Measurement
Conditions |
Slippage |
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40 degree C. |
0.1 |
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100 degree C. |
0.1 |
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Substrate:phenol resin plate
Tape area:10mmx20mm
Load:4.9N
Measurement condition:40 degree C. 100 degree C. x an hour
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The data provided herein are not guaranteed values, but rather measurement values given as an example.
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Applications |
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Fixing of FPC and stiffener |
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Fixing of FPC and Housing for Electronics equipment. |
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Fixing of compact cooling plate for electronics equipment. |
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Nitto Denko does not guarantee that the tape can be used for the example applications provided herein. You should make sure the tape is suitable for the substrate by applying to some of the material prior to using for practical application
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