M-5205

Heat activated tape, fast-activate in low temperature. Heat activated tape of flexible nonwoven fabric carrier that can stick quickly in low temperature.

Features

• Applied for heat activating in low temperature (100～120℃C in about 10 sec.).
• Available for positioning or temporary fixing with its slight pressure sensitive adhesive property initially.

Structure

Properties

Thickness [mm]	0.09
90° peeling strength [N/20mm]	23.8
Carrier material	Nonwoven fabric

[Remarks]

*The above values are sample observed values, not the guaranteed performance.

Application

• Bonding of covering material of memory card and frame parts.
• Bonding of card film lamination.