M-5205
Heat activated tape, fast-activate in low temperature. Heat activated tape of flexible nonwoven fabric carrier that can stick quickly in low temperature.
Features
- Applied for heat activating in low temperature (100-120°C in about 10 sec.).
- Available for positioning or temporary fixing with its slight pressure sensitive adhesive property initially.
Structure
Properties
| Thickness [mm] |
0.09 |
| 90° peeling strength [N/20mm] |
23.8 |
| Carrier material |
Nonwoven fabric |
* The above values are sample observed values, not the guaranteed performance.
Application
- Bonding of covering material of memory card and frame parts.
- Bonding of card film lamination.