The equipment is for laminating a dicing tape and NCF (Non-Conductive Film) including 2 in 1 type NCF in vacuum condition.
By introducing the technology of pre-cut tape handling / tape heating / vacuum mounting into a conventional Roll Tape Mounter, the equipment can laminate the dicing tape or NCF including 2 in 1 type NCF to wafers with uneven surfaces such as TSV wafers or bumped wafers.
Lamination of thin and soft adhesive tape such as NCF including 2 in 1 type NCF is possible.
Air void free and flat lamination is possible by vacuum flat press technology.
4 types of lamination methods are possible.
1. Conventional dicing tape lamination.
2. Two step lamination of NCF and dicing tape.
3. Lamination of 2 in 1 type NCF (combining NCF and dicing tape).
4. Lamination of 2 in 1 type die attach film (combining DAF and dicing tape).
8 inch and 12 inch wafer
Tape lamination to TSV (Through-Silicon Via) wafer.
Tape lamination to bumped wafers such as FC-BGA etc.