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Thin-film Metal Base Board CISFLEX®

Forms a high resolution circuit with photosensitive Pl and semi-additive copper plating on a metal base.

Contact Us

Business Hours:9:00~17:30 (Japan Time)

Except for Sat, Sun, and Holidays

Features

  • High density
  • High dimensional precision
  • Metal base

Construct

Connection Methods

Solder Bump

  • A coreless bump is formed with solder paste.
  • Can be thermally bound.

Flying Lead

The entire flying lead is Ni-Au plated. Can be bonded by normal temperature ultrasonic wave.

Process Accuracy

Gold-ball Bonding Pad

Flying Lead

Back Side Pad

[Remarks]

  • *SUS is used as the base metal.
  • *Double-sided pads are available.
  • *The plating on the pad and the flying lead is either Ni-Au or Au.

Applications

  • Hard disk drive

Contact Us

For inquiries about products.

Business Hours(Japan time)
9:00-17:30(Except for Sat, Sun, and Holidays)

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