Practical characteristic simulations that contribute to improvements in product reliability
Theoretical support and the visualization of phenomena that it is impossible to measure play an important role in improvement of product reliability. For many products, such as FPCs and NVH materials, various simulations are used to analyze stress, thermal fatigue strength, heat dissipation and electromagnetic fields.
Current Density Analysis
When plating a material, variations in plating thickness may occur, as current density is concentrated on the edges of the material. In order to solve this problem, current density analysis is carried out, which allows the structure of the plating bath to be optimized (electrode, material, closure plate position and dimensions and distance from each other, etc.) to ensure an even plating thickness.
Plating bath structure (cross-section) and current density distribution
Electromagnetic Field Analysis
One of the major characteristics of FPCs is their flexibility, which allows them to be mounted when bent or folded and which in turn helps to save space in devices. Analyzing the electromagnetic field when FPCs are bent is helpful in discovering the degree to which they are affected when it is bent and in formulating countermeasures. By analyzing the electromagnetic field strength distribution it is also possible to formulate measures for electromagnetic compatibility (EMC).
Electromagnetic field distribution when an FPC is folded in parallel
Electromagnetic field distribution when an FPC is folded orthogonally
Thermal Conductivity Analysis
With the miniaturization of electronic devices there have come calls for thinner, higher density circuit boards to be used in them. At the same time, there are demands for solutions to be found to the problem of the increased levels of heat that chips are now generating. Thermal conductivity analysis is used to design circuit boards and packages with outstanding heat dissipation characteristics.
Heat radiation results by the reinforcing plate (right) attached to back of a substrate