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Pressure-sensitive dicing tape

A combination of dicing and die attachment functions make this a very reliable film.

Dicing and die attachment functions together as one

This adhesive film is for fixing IC chips to lead frames, interposers, etc.

ELEP MOUNT EM series

Heat-resistant insulation for circuits and battery packs

Offers excellent insulation and heat-resistant capabilities.

Polyimide adhesive tape

This tape uses polyimide film for excellent heat-resistance.

No.360 series

For internal pressure adjustment, waterproofing, and dust-proofing casings

Prevents water and dust from penetrating the casing.

Internal pressure adjusting material

A porous film made of fluorine resin, offering water-resistance, water repellent, and weather resistant properties.

TEMISH

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