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Protection Tape Remover from TAIKO® Wafer NEL SYSTEM® series

This equipment is full-auto type Tape remover, removes protection tape (for back-grinding process) from TAIKO wafer patterned surface .

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Customer Support Center

Business Hours(India time)08:30-17:00

Except for Second Sat of each month, Sun, and Holidays

HR9000semicon_backgrinding_img_icon_ce

Full-auto Tape Remover for 200mmTAIKO wafer

Operation flow

Features

  • TAIKO wafer available
  • Non-contact transferring by Bernoulli method
  • Contamination-less transferring (by using Twin arm Robot)
  • Stable peeling performance by Peeling bar, Peeling trigger, Edge keeper
    (Peeling trigger & Edge keeper: Option)
  • Low stress peeling by partly peeling tape applying
  • Easy operation by Touch panel & Recipe function
  • Follow to CE mark / SEMI S2/S8
  • Adding SECS/GEM available

Basic spesifications

  • Applicable wafer size: 8 inch/6 inch
  • Applicable wafer thickness: TAIKOwafer:50um or more,
    Normal wafer: 150um or more
  • Throughput: TAIKOwafer:30wafers/hr.
    Normal wafer: 50wafers/hr
  • *Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
    In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

Contact Us

Customer Support Center

Business Hours(India time)08:30-17:00(Except for Second Sat of each month, Sun, and Holidays)

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