Contamination-less transferring (by using Twin arm Robot)
Stable peeling performance by Peeling bar, Peeling trigger, Edge keeper
(Peeling trigger & Edge keeper: Option)
Low stress peeling by partly peeling tape applying
Easy operation by Touch panel & Recipe function
Follow to CE mark / SEMI S2/S8
Adding SECS/GEM available
Applicable wafer size： 8 inch／6 inch
Applicable wafer thickness： TAIKOwafer：50um or more,
Normal wafer: 150um or more
Normal wafer： 50wafers/hr
*Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.