Thermal Release Tape For Hard Substrate NWS-TS322F
Capable of processing brittle wafer.
Capable of releasing/collecting semiconductor wafers at any stage by constant support of the semiconductor wafer using a supporting wafer. Especially recommended for semiconductor wafer backgrind processing.
Adhesive strength of pressure-sensitive adhesive
[N/20mm] (to silicon)
* The figures are a sample of observed values, not guaranteed performance.
* After removing this tape, ultralow-volume materials (organic elements) from the adhesive sheet may remain on the substrate. Particles tend to remain, especially on silicon wafers. Please confirm that residual material or particles do not cause problems with the application.