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Heat Transfer

Thermal Conduction Sheet with Superior Heat Dissipation and a Remarkable Cooling Effect in Electronic Devices

Thermal conduction sheet effective for heat dissipation and cooling of integrated circuit devices, etc.

HT Sheet

Aluminum Substrate with Superior Heat Dissipation

Aluminum substrate with excellent heat dissipation, to be used in place of glass epoxy circuit boards. 

SL Series

Aluminum Foil Tape, Featuring Excellent Heat Dissipation, Magnetic Shielding, Insulation, and Moisture Prevention

Fixation of exothermic parts.

NITO FOIL AT-30

0.1mm Thick Aluminum Foil Tape, Featuring Excellent Heat Dissipation, Magnetic Shielding, Insulation, and Moisture Prevention

Fixation of exothermic parts.

NITO FOIL AT-50

0.13mm Thick Aluminum Foil Tape, Featuring Excellent Heat Dissipation, Magnetic Shielding, Insulation, and Moisture Prevention

Fixation of exothermic parts.

NITO FOIL AT-80

Exhaust smoke

Adhesive sheet with air and moisture permeability.

NITOTHROUGH

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