Skip to Main text

Semiconductor Wafer Tape SWT 20TP+

Wafer processing tape designed for for semiconductor pre-cut dicing processes.

SWT 20TP+ consists of a clear transparent PVC film coated with a pressure sensitive acrylic-based adhesive and is covered with a one-sided siliconised polyester liner. The tape is manufactured in clean room environment. The product is wound on a plastic core with the PVC film on the inside. Rolls are individually packed in a double polyethylene anti-static bag and foreseen with lot number.
Contact Us

Business Hours (WET) 8:00h-17:00h

Except for Sat, Sun, and Holidays

Features

  • Excellent deformation behaviour
  • Excellent adhesion level
  • Easy unwind
  • Recyclable
  • Clean room product

Structure

  1. Clear transparent PVC film
  2. Pressure sensitive acrylic-based adhesive
  3. One-sided siliconised polyester liner

Properties

Adhesive type Acrylic-based
Film type PVC film
Total thickness 0.130 mm
Adhesion to SI-wafer 0.95 N/20 mm
Tensile strength MD 90 N/20 mm
Elongation MD 270%
Unwind force 0.6 N/20 mm
Color Transparent
Impurities content < 3 ppm

Application

Nitto Semiconductor Wafer Tape SWT 20TP+ is an ideal product for processing semiconductor wafers, to be applied on the backside of the wafer (non-active side).

Contact Us

Business Hours (WET) 8:00h-17:00h (Except for Sat, Sun, and Holidays)

Adobe Reader Download

Adobe Reader is required to view PDF files.
If not yet installed, please download it from the Adobe website.

Back to Page Top