Wafer Re-Mounter (MA3000III + Frame removal unit) NEL SYSTEM® series
This equipment is full-auto type Wafer Re-mounter for 300mm wafer, first removes the frame from wafer-mount-frame by support tape, and next mounts the wafer on the new frame by dicing tape, and removes the support tape from the wafer,
*Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.
This equipment irradiated UV light to dicing tape on the wafer back side to reduce the adhesion strength . Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.