Thermal Release Tape For Hard Substrate NWS-Y5V/NWS-TS322F
Capable of processing brittle wafer.
Capable of releasing/collecting semiconductor wafers at any stage by constant support of the semiconductor wafer using a supporting wafer. Especially recommended for semiconductor wafer backgrind processing.
Adhesive strength of pressure-sensitive adhesive
[N/20mm] (to silicon)
* The figures are a sample of observed values, not guaranteed performance.
* After removing this tape, ultralow-volume materials (organic elements) from the adhesive sheet may remain on the substrate. Particles tend to remain, especially on silicon wafers. Please confirm that residual material or particles do not cause problems with the application.
This equipemt is full-auto type Tape applicator, applies protection tape (for back-grinding process) on 300mm wafer patterned surface in vacuum condition. Mechanical pressing function is also equipped.
This equipment removes protection tape from the wafer patterned surface after the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.