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Thin-film Metal Base Board CISFLEX®
Forms a high resolution circuit with photosensitive Pl and semi-additive copper plating on a metal base.
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Business Hours (WET) 8:00h-17:00h
Except for Sat, Sun, and Holidays
- High density
- High dimensional precision
- Metal base
- A coreless bump is formed with solder paste.
- Can be thermally bound.
The entire flying lead is Ni-Au plated. Can be bonded by normal temperature ultrasonic wave.
Business Hours (WET) 8:00h-17:00h (Except for Sat, Sun, and Holidays)
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