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Nitto Denko Launches Ultra-thin Type Foamed Sealing Material
Environment-friendly and supports thickness reduction of electronic devices
3.14.2008
Japan's leading diversified materials company Nitto Denko Corporation (Nitto Denko) has newly added to its line of SCF® products an ultra-thin type called “SCF® 400”, which is thinner than the conventional SCF® yet having the same level of flexibility, with the aim of supporting the design thickness reduction of electronic devices, the company said today.
SCF® which is a sealing material of thin foamed layer used for dust-proofing and cushioning of electronic devices, derives its trade name from "Super Clean Foam".
Available in the thickness range of 0.3 – 0.4 mm, SCF® 400 is thinner than the conventional SCF® by 0.1 – 0.2 mm, and is made of a foamed thermoplastic olefin polymer fabricated into a thin layer, as in the case of conventional SCF® line of products. Moreover, SCF® 400 is an environment-friendly tape product containing no halogen-based substances.
Background of the Development
Generally used for filling the crevices inside electronic devices are foamed structures serving as sealing materials for dust-proofing and cushioning as well as shock-proofing of electronic parts, especially liquid crystal displays in cell phones. Since 2002, Nitto Denko has been marketing the olefin-based thin foamed layers with the trade name "SCF®" for such applications.
However, with the design of electronic devices such as cell phones and mobile audiovisual equipment becoming ever thinner these days, Nitto Denko has succeeded in newly developing the ultra-thin SCF® 400 in order to meet the market trend.
Product Characteristics
1. Environment-friendly Tape
Because foamed sealing materials usually used inside electronic devices are required to be flame-retardant, they are added with halogen-based flame-retardant additves. On the other hand, SCF® is made without using any plasticizers or additives that are normally used in making foamed materials. For that reason, SCF® emits very little volatile gases from contained impurities, and thus imparts no adverse effect on the electronic device in which it is used.
2. Ultra-thinness of 0.3 – 0.4 mm and Flexibility Realized
Conventionally, foamed products have been generally created with larger air bubbles inside, in order to raise the expansion ratio. Nitto Denko, on the other hand, has leveraged its own technology to achieve a high expansion ratio while keeping the fine bubble size, so that the company succeeded in holding down the bubble size in SCF® 400 to about half that of the conventional foams, at some 40 microns (1 micron = 1-millionth of a meter).
In addition, Nitto Denko also succeeded in securing the same-level flexibility for SCF® 400 as in the conventional SCF®. The new product has the added benefit of fitting into clearances much smaller than the conventional level, at min. 0.1 mm, so that when it is applied, it does not cause excessive rebound to parts and housings. As it also excels in conforming to curved and bumpy surfaces, it offers larger freedom in designing the electronic devices.
Application of SCF® 400
1) Dust-proofing sealing material for mobile electronic devices (cell phones and mobile AV devices)
2) Cushioning sealing material for medium- and large-sized electronic devices (flat TVs, PCs and digital cameras)
3) Cushioning and sound-proof materials for small parts in electronic devices
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