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[Company Information]Nitto Denko to Boost Production Capacity for Environment-compliant Semiconductor Encapsulating Resins
New Plant to Be Built at Nitto Electronics Kyushu
2.1.2008
Japan’s leading diversified materials company Nitto Denko Corporation (Nitto Denko) has decided to boost its production of environment-compliant semiconductor encapsulating resins, by newly constructing a plant for such resins at its subsidiary Nitto Electronics Kyushu (NTEK), the company announced today.
Located in Saga Pref. in the northern part of Kyushu Island, western Japan, NTEK is engaged in the manufacture of semiconductor encapsulating resins and encapsulating mold cleaning sheets.
Background of the Project
Engaged, among others, in the manufacture and sale of resins for encapsulating semiconductor chips Emainly thin surface-mounted types going into various electronic devices such as personal computers, mobile music players and cell phones, Nitto Denko holds a top-level share in the world market for such resins.
With the enforcement of the European Union (EU)’s “Restriction of Hazardous Substances (RoHS)" Directive (*) in July 2006, Japanese household appliance and digital electronic device manufacturers have embarked upon efforts to eliminate the use of materials containing environment-loading substances, as typically represented by lead and halogens, in their products.
(*) Restriction of Hazardous Substances (RoHS) Directive:
Formally called “The Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment". The directive requires that new electrical & electronic equipment launched in the EU market on July 1, 2006 or later will in principle not contain the said six hazardous substances.
Encapsulating resins being no exception to RoHS requirements, Nitto Denko has been developing more environment-compliant resins that are free of environment-loading substances such as bromine and antimony.
With the environmental regulations expected to turn even more stringent from now on, and the demand expanding for environment-compliant resins including those used for state-of-the-art surface-mounted packages such as ball grid array (BGA)-types, Nitto Denko has decided to construct the new resin plant at NTEK which is one of the major domestic production sites, in order to meet the increased demand.
Outline of the New Plant Project
| 1. | Nature of the Investment: | New plant construction and installation of resin pelletizer |
| 2. | Construction Site: | Nitto Electronics Kyushu Corp. in Saga Pref., Japan |
| 3. | Investment Amount: | ca. ¥2.6 billion (Phase I) |
| 4. | Total Floor Space: | ca. 8,100 sq.m. (Phase I), for a steel- structured 2-story building |
| 5. | Products: | Environment-compliant resins for semiconductor encapsulation |
| 6. | Production Value: | ca. ¥6 billion (Initial year of operation) |
| 7. | Total employee Headcount: | ca. 200 (At start-up in 2008) |
| 8. | Start of Construction: | March 2008 |
| 9. | Completion: | September 2008 |
Rendering of Completed Plant
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