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Nitto Denko to Make New Entry into Chip Mounting Films
Mass Production of CARRIERFLEXTM Underway
3.28.2006
Japan’s leading diversified materials company Nitto Denko Corporation will embark upon mass production of CARRIERFLEXTM, a film-form circuit board (FCB) for semiconductor chip mounting, the company announced today. Nitto Denko recently completed the commercial development of CARRIERFLEXTM which is used for mounting integrated circuit chips for driving liquid crystal displays (LCDs).
Made by using Nitto Denko’s own semi-additive process(*), CARRIERFLEXTM serves as the conducting medium of an FCB, and is endowed with performance characteristics that are equivalent or better than existing products in terms of an ultra fine circuit wiring technology (20-micron pitch), high circuitry adhesion strength, high cumulative dimensional tolerance of the circuit-formed segment (“circuit dimensional toleranceE, and high insulation reliability.
Nitto Denko plans to invest a total of ¥10 billion ($87 million) in building a dedicated CARRIERFLEXTM production facility within its Kameyama complex near Nagoya, Japan. The facility would encompass the entire process including the base film material design generation and CARRIERFLEXTM production, through final product inspection. The company is planning to achieve a 50 million-units per month production capacity by the end of FY 2007.
(*) Semi-additive process:
An insulation layer is formed on the circuit board of an organic material and wiring is formed thereupon by a copper plating process.
Background
Nitto Denko has been active in the circuit materials field, based on its flagship products consisting of flexible printed circuits (FPC) mainly for cell phones, and thin-film metal core substrates for magneto resistive heads (MRHs) going into hard disk drives.
The CARRIERFLEXTM technology successfully developed this time is an FCB for mounting LC driver chips by taking advantage of Nitto Denko’s technological competencies in polyimide resin synthesis, sputtering and semi-additive process -- all nurtured and perfected in the course of creating the thin-metal MRH core substrates.
With LCDs moving up to higher image qualities (higher pixel densities) because of the shift in TV screens toward fully high-definition imaging, LC driver chips are constantly facing an ever-higher wiring density requirement. The technological requirements imposed on chip-mounting FCBs are also tightening in terms of ultra fine wiring, high adhesion strength, high cumulative circuit dimensional tolerance and high insulation reliability.
It is with such a background that Nitto Denko has decided to newly enter into the subject field by riding on the product differentiation advantage which has emerged as a result of the CARRIERFLEXTM technology development achieved by leveraging the company’s own semi-additive process.
CARRIERFLEXTM Performance Characteristics
1. Ultra Fine Wiring Density
Semi-additive process enables formation of circuitry with 20-micron (µ) pitch (conductor width plus peak-to-peak gap width). Conductor is formable to thicknesses of 8 µ or more according to customer specification. Nitto Denko can conduct integrated in-house production by a Roll-to-Roll process using materials of 300-mm widths.
2. High circuitry Adhesion Strength
Adhesion strength between the polyimide substrate material and the conductor layer at a level of 1 kN/m has been successfully realized.
3. High Insulation Reliability (Migration Characteristics)
Adequate insulation characteristics have been achieved even with a wiring density at 20-µ pitch. (85 degrees C 85% x 60V charge x 1,000 hr)
4. High Cumulative Circuit Dimensional Tolerance
Owing to its own polyimide film processing technology, Nitto Denko has been able to successfully limit the fluctuations in cumulative circuit dimensional tolerance of the LC driver chip mount segment and the LC panel pressure adhesion segment to less than one half those of conventional processing techniques.
Outline of Dedicated CARRIERFLEXTM Production Facility
| 1. | Location: | Nitto Denko’s Kameyama Plant |
| 2. | Cumulative Floor Space: | ca.12,000 sq.m. (4-storey RC bldg) |
| 3. | Completion Date: | February 2006 |
| 4. | Total Investment: | ca. ¥10 billion ($87 million) |
| 5. | Product: | CARRIERFLEXTM |
| 6. | Production Capacity: | 15 million pieces by end/1st Half FY2006 50 million pieces by end/FY 2007 |
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