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Development of thin layer foam sealing material for electronic equipment containing no halogen for green procurement
Industrial Products Div., Tape-Material Business Sector
2.25.2003
Nitto Denko Corporation is proud to announce that we have developed Super Clean Foam (SCF), a foam sealing material to be used in electronic equipment as cushioning and to seal out dirt. SFC is made by forming a thin layer of foam from thermoplastic olefin resin. SFC is also the world’s first fire-resistant foam sealing material that contains no halogen, and conforms to requirements for green procurement of equipment manufacturers. Because it is thin and flexible, the material is also applicable to extremely compact applications.
Product Structure
Product features
1) Contains no halogen
Uses thermoplastic olefin resin instead of halogen to make the foam fire-resistant. Contains absolutely no halogen. (Has obtained fire-resistant standard certification UL94 HF1.)
2) Contains no impurities and minimizes negative effect of gas produced
Uses absolutely no plastics or additives used to produce conventional foam. Out-gas contained in such impurities is kept down to a minute level, thereby minimizing negative effect of gas produced on electronic equipment.
3) Thin and flexible
Able to minimize cell diameter (approx. 80 µm) from both aspects of resin material design and foam structural design. This allows the foam to be made thinner (up to 0.5 mm) without losing its foam properties while also offering superior flexibility. This enables the foam to be used in extremely fine clearances in electronic equipment that up to now were impossible with conventional foam. Even if compressed and applied it conforms to uneven surfaces of parts, etc., and minimizes excessive repulsion to parts and frame.
Applications
Dust-proof seal for data terminals (cellular telephones/PDA)
Seal for cushioning of electronic equipment (computers, digital cameras, etc.)
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