It is a support menu from here.
Main Menu
Product Information
Development of dust removal adhesive tape for removing foreign matter in the manufacturing process for PC boards
Industrial Materials Division, Tape-Material Business Sector
11.8.2002
Nitto Denko Corporation has developed SDR50 dust removal adhesive tape that effectively removes foreign matter in the PC board manufacturing process. The tape removes foreign matter (primarily cuttings) produced during the PC board manufacturing process. Uses foaming adhesive to obtain a high dust removal effect. Addition of an anti-static layer reduces the amount of dirt that adheres by static electricity. The product has therefore attracted attention because it contributes to higher PC board yield.
Background of product development
The manufacturing process of PC boards (bot rigid and FPC types) includes a mixture of processes such as bonding, exposure and component placement that abhor dirt produced by processes such as drilling holes, cutting, punching and grinding. To what degree dirt produced by these processes can be eliminated is instrumental to improving yield. In most cases, dirt is removed by washing with water or blowing. Water however may be another source of dirt and blown away dirt can settle on the work again.
We considered using existing tapes for removal of foreign matter, but they did not have the adhesive characteristics necessary to effectively remove foreign matter from PC board with uneven surfaces. They also posed other problems involving foreign matter attracted by static electricity and also produced a negative effect on the rear silicon surface treatment of the tape in subsequent processes (unsatisfactory wiring insulation).
The newly developed SDR50 dust removal adhesive tape solves these problems. The product uses a foam adhesive that enables it to effectively and continuously remove various types of foreign matter. An antistatic treatment layer is provided to minimize static electricity and foreign matter picked up by static electrocute. The tape uses no silicon rear surface treatment so products are not negatively affected by silicon coming off the tape.
Product Structure
Usage method
There are two inline cleaning methods (direct type and transfer type) and one offline cleaning method (handy type). Various sizes are available according to the customerÕs process.
Applications
Can be used for removal of cuttings produced in the PC board manufacturing process, removal of other foreign matter adhering to the PC board surface and removal of foreign matter in processes that abhor foreign matter such as the optical film manufacturing process.
Contuct Us
Footer Area
