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Product Information
Development of heat-resistant double coated adhesive tape
Can be used with lead-free solder and rationalizes the process.
Double Coated Products Division, Tape-Material Business Sector
7.3.2002
Nitto Denko Corporation has newly developed No. 5919M heat-resistant double-coated adhesive tape. The heat-resistant double coated adhesive tape used when fastening flexible PC boards (FPC) mounted with surface mounted devices (SMD) inside electronic equipment, and is able to withstand lead-free solder when components are mounted. Because components can be mounted with the tape applied to the FPC, the product has attracted attention as an environment-friendly product that facilitates the process.
Background of development
Recently an increasing number of solder that does not contain lead (lead-free solder) is being used for mounting electronic components in order to address environmental concerns. Lead-free solder requires a higher temperature (melting point) than conventional solder, resulting in the surface or FPCs being exposed to temperatures of 230 to 250°C (200 to 220°C for conventional solder).
Up to now, the adhesive of double coated adhesive tape would be weakened or foam by such high temperatures, or the peeling paper would burn, making it impossible to peel off the tape, etc. The tape was therefore applied to the FPC after the components were mounted (soldered). It is however difficult to apply tape to FPCs on which components are already mounted, thereby increasing the number of steps in the process.
No. 5919M heat-resistant double-coated adhesive tape was developed to solve these problems. Special heat-resistant adhesive and peeling paper enable the tape to withstand high temperatures required for mounting SMDs with lead-free solder. The number of steps in the process can be dramatically reduced by applying the tape to the FPC with a laminator or press prior to mounting the components and also contributes to better adherence reliability.
To enable tape end application
Product Structure
Product Characteristics
1) Facilitates switch to lead-free solder to address environmental concerns.
Because heat resistance including release liner has been enhanced (in comparison with existing Nitto Denko products), it can help customers switch to lead-free solder.
2) Enables rationalization by reducing the number o steps in the process.
Enables dramatic reduction of number of steps because work that used to have to be done by hand after components were mounted can now be done by machine prior to mounting.
3) Enhances bonding reliability.
Because it uses heat-resistant adhesive, it does not foam or lose adhesive strength at high temperatures needed for lead-free solder, thereby enhancing bonding reliability.
4) Doesn’t have a negative effect on other things.
Contains a minimal amount of out gas and ion impurities, so it’s not likely to have a negative impact on FPC or equipment.
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