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Reduces Substrate Thickness 50 Percent
Nitto Denko Develops Ultra-Thin, Multi-Layer Flexible Printed Circuit Substrate
4.17.2002
Osaka, April 5, 2002 - JCN Newswire - Nitto Denko Co., one of JapanÅfs leading makers of electronic materials, is pleased to announce it developed an ultra-thin, multi-layer, flexible printed circuit substrate that measures half the thickness of existing circuit boards and has outstanding wiring density.
A four-layer substrate measures 0.2 mm, while an eight-layer substrate is a mere 0.35 mm thick. The substrateÅfs wiring density has a line-to-space ratio of 50 micrometers by 50 micrometers and contributes to the reduction in substrate thickness. The new substrate has a wide range of applications in compact electronic devices, optical sensors, and semiconductor interposers.
The use of FPC materials differs as opposed to the rigid materials commonly found in this type of product and is available in two different forms, a solder filled-via type and blind-via type, to cater to different multi-layer and production quantity requirements.
Demands for reduced size, lighter weight and slimmer design are increasing continually in the electronics industry. As such, the same demands are being directed towards those in the industry who produce component packages. Recently, manufacturers have started to ask component producers for components in the micron range.
Up until now, the vast majority of the demand for packaged/mounted substrates has been met by glassnest 6-layer substrate produced by this method was 0.5mm thick. While certain products combine rigid substrates with FPC materials, the rigid substrates greatly increased the thickness of these products.
Product Characteristics
1. Ultra-thin design
Approximately 50% thinner than existing rigid substrates.
4-layer type: 0.2mm thick, 6-layer type: 0.25mm thick, 8-layer type: 0.35mm thick
2. High circuit density across all layers: Line/space
Line/space: 50 micrometers/50 micrometers, via radius: 100 micrometers (50 percent that of existing rigid substrates)
3. Wiring flexibility
Substrate composed entirely of FPC materials, the flexibility of which make possible 3D mounting/packaging when necessary.
Substrate Structure
1. Blind-via Typet
Ideal for mass production. Reliability of conductivity has been improved with the use of through hole coatings on internal layers, and blind-via coatings on external layers. Reel-to-reel continuous production is also possible.
2. Solder Filled-via Type
Produced by fixing multiple 2-layer FPCs together. Ideal for use in multi-layer circuit substrates of six or more layers. Heat-resistant, lead-free solder paste with average grain diameter of less than 10 micrometers used to maintain conductivity.
FY2002 sales targets have been set at 1 billion yen, with an annual sales target of 5 billion yen set for a time three years from now. The new substrate will be sold through Nitto Denko sales agencies.
About Nitto Denko Co.
Incorporated in 1918, Nitto Denko designs, manufactures and sells a wide range of adhesive tapes, electronic components, and medical equipment. The company remains focused on attaining top global market share in many of its core products. The company has 10 divisions and group sales in fiscal year 2000 amounted to 365.6 billion yen.
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